Ultrasonic bonding

Herrmann Ultrasonics provides customized solutions for bonding, slitting, cutting and embossing applications of nonwoven, film and textile materials. New generation ultrasonic bonding modules enable high-speed-production and constant quality without the use of adhesive and consumables, allowing for stable processes even at variable speeds. Technical improvement inside the Ultraspin module: the newly designed bearing sleeve technology (versus the alternative diaphragm system), which can be combined with the patented MICROGAP control to bond materials with consistent quality while no contact with the anvil.

SOURCE Herrmann Ultrasonics Inc., Bartlett, Ill, U.S.A., +1 630 626 1626