RIKEN announces ultra-thin electronics breakthrough

April 1st, 2022

These images are from the conformability test on a curved surface (radius: 0.5 mm). Ultra-thin films bonded using (top) water-vapor plasma assisted bonding or (bottom) standard adhesive. Conformability was much better for water-vapor plasma assisted bonding. Photos: RIKEN Researchers at the RIKEN Center for Emergent Matter Science (CEMS) and the RIKEN Cluster for Pioneering Research […]

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